11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany

11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany /

Collection of selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany. The 16 papers are grouped as follows: Chapter 1: Development and Prototyping, Chapter 2: Printing Technologies, Chapter 3: Mat...

Full description

Saved in:
Bibliographic Details
Corporate Author: International Congress Molded Interconnect Devices Nuremberg, Germany, and Fuerth, Germany
Other Authors: Franke, Jörg (Prof. Dr.-Ing.) (Editor)
Format: Electronic Conference Proceeding eBook
Language:English
Published: Pfaffikon, Switzerland : TTP, 2014.
Series:Advanced materials research ; v. 1038.
Subjects:
Molded interconnect devices.
Three-dimensional display systems > Congresses.
Online Access: Full text (Emmanuel users only)

Internet

Full text (Emmanuel users only)

Similar Items