Integrated interconnect technologies for 3D nanoelectronic systems /
This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source.
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| Other Authors: | , |
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| Format: | Electronic eBook |
| Language: | English |
| Published: |
Boston, Mass. ; London :
Artech House,
©2009.
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| Series: | Artech House integrated microsystems series.
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| Subjects: | |
| Online Access: |
Full text (Emmanuel users only) |
Table of Contents:
- Integrated Interconnect Technologies for 3D Nanoelectronic Systems; Contents; Foreword; Preface; Chapter 1: Revolutionary Silicon AncillaryTechnologies for the Next Era of Gigascale Integration; Chapter 2: Chip-Package Interaction and Reliability Impact on Cu/Low-k Interconnects; Chapter 3: Mechanically Compliant I/O Interconnects and Packaging; Chapter 4: Power Delivery to Silicon; Chapter 5: On-Chip Power Supply Noise Modeling for Gigascale 2D and 3D Systems; Chapter 6: Off-Chip Signaling; Chapter 7: Optical Interconnects for Chip-to-Chip Signaling.